Curtis has applied its thin film skills to the fulfilment of a variety of microelectronic requirements. Often the  metallization of such parts imcreases their ability to withstand mechanical and thermal stresses or  extends their range of applications to meet specific tolerances. Curtis is also equipped to perform a variety of metal forming, cutting and finishing operations,  depending on customer specifications.  A good example is the fabrication of lead frames for use in dual-line and flat ceramics packages. Other applications include dielectric coatings, chip  carriers and isolation devices